Development of a Characterization Workflow for Reliable Porous Copper Films using SEM-FIB Tomography and Advanced Image Analysis
Development of a Characterization Workflow for Reliable Porous Copper Films using SEM-FIB Tomography and Advanced Image Analysis
Monday, November 11, 2019: 3:10 PM
D 137/138 (Oregon Convention Center)
Summary:
Moore´s law leads to enhanced device performance but also triggers challenges with respect to the materials in use. To keep the trend going, it is necessary to introduce new material concepts, e.g. porous materials. Especially for the production, the characterization of the pore parameters like the porosity, pore size distribution etc. is significantly important. In this paper, we present (1) 3D nm-FIB-tomography results on porous copper and (2) possibilities for image analysis offering reliable material characterization. The goal is to provide proper design guidelines for industrial related processing to produce reliable porous copper films for applications in microelectronics.
Moore´s law leads to enhanced device performance but also triggers challenges with respect to the materials in use. To keep the trend going, it is necessary to introduce new material concepts, e.g. porous materials. Especially for the production, the characterization of the pore parameters like the porosity, pore size distribution etc. is significantly important. In this paper, we present (1) 3D nm-FIB-tomography results on porous copper and (2) possibilities for image analysis offering reliable material characterization. The goal is to provide proper design guidelines for industrial related processing to produce reliable porous copper films for applications in microelectronics.