Development of a Characterization Workflow for Reliable Porous Copper Films using SEM-FIB Tomography and Advanced Image Analysis

Monday, November 11, 2019: 3:10 PM
D 137/138 (Oregon Convention Center)
Mr. Andi Wijaya , Materials Center Leoben Forschung GmbH, Leoben, Austria
Mrs. Barbara Eichinger , Infineon Technologies Austria AG, Villach, Austria
Dr. Martin Mischitz , Infineon Technologies Austria AG, Villach, Austria
Dr. Roland Brunner , Materials Center Leoben Forschung GmbH, Leoben, Austria

Summary:

Moore´s law leads to enhanced device performance but also triggers challenges with respect to the materials in use. To keep the trend going, it is necessary to introduce new material concepts, e.g. porous materials. Especially for the production, the characterization of the pore parameters like the porosity, pore size distribution etc. is significantly important. In this paper, we present (1) 3D nm-FIB-tomography results on porous copper and (2) possibilities for image analysis offering reliable material characterization. The goal is to provide proper design guidelines for industrial related processing to produce reliable porous copper films for applications in microelectronics.
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