Microscopy

Monday, November 11, 2019: 3:10 PM-4:50 PM
D 137/138 (Oregon Convention Center)
Dr. Lianfeng Fu, Lam Research Corporation and Mr. Ryan Fredrickson, On Semiconductor
3:10 PM
Development of a Characterization Workflow for Reliable Porous Copper Films using SEM-FIB Tomography and Advanced Image Analysis
Mr. Andi Wijaya, Materials Center Leoben Forschung GmbH; Mrs. Barbara Eichinger, Infineon Technologies Austria AG; Dr. Martin Mischitz, Infineon Technologies Austria AG; Dr. Roland Brunner, Materials Center Leoben Forschung GmbH
3:35 PM
Speeding up Chip Layer Imaging with a Multi-Beam SEM
Dr. Anna Lena Eberle, Carl Zeiss Microscopy GmbH; Dr. D. Zeidler, Carl Zeiss Microscopy GmbH; Mr. Tomasz Garbowski, Carl Zeiss Microscopy GmbH; Dr. Stephan Nickell, Carl Zeiss Microscopy GmbH
4:00 PM
Analysis of Voltage Contrast in Secondary Electron Image using High Energy Electron Spectrometer
Ms. Natsuko Asano, JEOL Ltd.; Dr. Shunsuke Asahina, JEOL Ltd.; Dr. Natasha Erdman, JEOL USA Inc.
4:25 PM
Submicron Simultaneous IR and Raman Spectroscopy (IR-Raman): Breakthrough Developments in Optical Photothermal IR (O-PTIR) combined with Raman for Enchanced Failure Analysis
Mr. Jay Anderson, Photothermal Spectroscopy Corp.; Dr. Mustafa Kansiz, PhD, Photothermal Spectroscopy Corp.; Dr. Curtis Marcott, PhD, Photothermal Spectroscopy Corp.; Dr. Michael K. Lo, Photothermal Spectroscopy Corp.
See more of: Technical Program