Speeding up Chip Layer Imaging with a Multi-Beam SEM
Speeding up Chip Layer Imaging with a Multi-Beam SEM
Monday, November 11, 2019: 3:35 PM
D 137/138 (Oregon Convention Center)
Summary:
Reverse engineering of today’s integrated circuits requires both high speed imaging and data processing. The architecture of our multi-beam scanning electron microscopes is scalable for a large range of beam numbers, providing the required imaging speed. Data processing for reverse engineering on images acquired with a multi-beam SEM has been successfully shown in preliminary tests.
Reverse engineering of today’s integrated circuits requires both high speed imaging and data processing. The architecture of our multi-beam scanning electron microscopes is scalable for a large range of beam numbers, providing the required imaging speed. Data processing for reverse engineering on images acquired with a multi-beam SEM has been successfully shown in preliminary tests.