GHz-SAM for Warped Samples using HiSA

Monday, November 11, 2019: 4:00 PM
F 150/151 (Oregon Convention Center)
Dr. Christian Hollerith , Infineon tech. AG, Neubiberg, Germany
Dr. Peter Hoffrogge , PVA TePla Analytical Systems GmbH, Aalen, Germany
Mr. Duy-Long Le , Infineon tech. AG, Neubiberg, Germany
Martin Boeckler , Hochschule-Aalen, Aalen, Germany

See more of: 3D Device Failure Analysis II
See more of: Technical Program