3D Device Failure Analysis II

Monday, November 11, 2019: 3:10 PM-4:50 PM
F 150/151 (Oregon Convention Center)
Dr. Christian Schmidt, Nvidia and Kristofor Dickson, NXP
3:10 PM
Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
Dr. Kristof J.P. Jacobs, Imec; Dr. Yunlong Li, Imec; Prof. Ingrid De Wolf, KU Leuven; Mr. Stefaan Van Huylenbroeck, Imec; Dr. Eric Beyne, Imec
3:35 PM
GHz-Scanning Acoustic Microscopy combined with ToF-SIMS/AFM for wafer-level failure analysis of bonding interfaces.
Prof. Ingrid De Wolf, imec; Mr. Ahmad Khaled, imec; Dr. Alexis Franquet, imec; Dr. Valentina Spampinato, imec; Dr. Thierry Conard, imec; Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Ingo Wiesler, PVA Tepla Analytical Systems GmbH
4:00 PM
GHz-SAM for Warped Samples using HiSA
Dr. Christian Hollerith, Infineon tech. AG; Dr. Peter Hoffrogge, PVA TePla Analytical Systems GmbH; Mr. Duy-Long Le, Infineon tech. AG; Martin Boeckler, Hochschule-Aalen
4:25 PM
Machine learning assisted signal analysis in Acoustic Microscopy for non-destructive defect identification
Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
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