Second Order Effect Monitoring During Backside Milling for Functional Endpoint Detection

Thursday, November 14, 2019: 8:25 AM
F 150/151 (Oregon Convention Center)
Mr. Anthony F. George , Battelle Memorial Institute, Columbus, OH
Mr. Isaac W. Goldthwaite , Battelle Memorial Institute, Columbus, OH
Mr. Jonathan Scholl , Battelle Memorial Institute, Columbus, OH
Dr. Katie liszewski , Battelle Memorial Institute, Columbus, OH
Dr. Jeremiah P. Schley , Battelle Memorial Institute, Columbus, OH
Dr. Thomas F. Kent , Battelle Memorial Institute, Columbus, OH

Summary:

A methodology is presented for functional endpoint detection during backside milling of integrated circuit packaging. This is achieved by monitoring second order effects in response to applied device strain.