Second Order Effect Monitoring During Backside Milling for Functional Endpoint Detection

Thursday, November 14, 2019: 8:25 AM
F 150/151 (Oregon Convention Center)
Mr. Anthony F. George , Battelle Memorial Institute, Columbus, OH
Mr. Isaac W. Goldthwaite , Battelle Memorial Institute, Columbus, OH
Mr. Jonathan Scholl , Battelle Memorial Institute, Columbus, OH
Dr. Katie liszewski , Battelle Memorial Institute, Columbus, OH
Dr. Jeremiah P. Schley , Battelle Memorial Institute, Columbus, OH
Dr. Thomas F. Kent , Battelle Memorial Institute, Columbus, OH

Summary:

A methodology is presented for functional endpoint detection during backside milling of integrated circuit packaging. This is achieved by monitoring second order effects in response to applied device strain.
See more of: Sample Preparation and Device Deprocessing
See more of: Technical Program