Isolating an Open in 2.5D µBump & Chip Bump Chains using SDR, EBAC and Capacitive Measurements

Wednesday, November 13, 2019: 9:15 AM

D 137/138 (Oregon Convention Center)

Mr. Kevin A. Distelhurst, BS/MS Electrical Engineering , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Doug B. Hunt , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Daniel A. Bader , GLOBALFOUNDRIES, Essex Jct., VT