Study of thermal cycle induced CPI failure mode in a lidded FC-BGA package
Study of thermal cycle induced CPI failure mode in a lidded FC-BGA package
Wednesday, November 13, 2019: 8:25 AM
D 137/138 (Oregon Convention Center)
Summary:
Chip package interaction (CPI) has become critical reliability issue along with the advancement of semiconductor nodes and packaging technology. Thermal cycling is one of the established methods in determining the reliability of packaged chips. It (thermal cycling) is used to drive the failure mechanism caused by thermal expansion mismatch between dissimilar materials: silicon, solder, copper, underfill and package. In this work, thermal stressing was used to get insight into reliability of a large package system and the focus was to understand the failure mode with systematic failure analysis approach to help improving the robustness, reliability and lifetime of the chip.
Chip package interaction (CPI) has become critical reliability issue along with the advancement of semiconductor nodes and packaging technology. Thermal cycling is one of the established methods in determining the reliability of packaged chips. It (thermal cycling) is used to drive the failure mechanism caused by thermal expansion mismatch between dissimilar materials: silicon, solder, copper, underfill and package. In this work, thermal stressing was used to get insight into reliability of a large package system and the focus was to understand the failure mode with systematic failure analysis approach to help improving the robustness, reliability and lifetime of the chip.