Flip Chip and Backside Preparation Techniques

Sunday, November 10, 2019: 9:00 AM
D 137/138 (Oregon Convention Center)
Dr. Edward I. Cole Jr., FASM , Sandia National Laboratories, Albuquerque, NM
Kira L. Fishgrab , Sandia National Laboratories, Albuquerque, NM
Dr. Daniel L. Barton , Sandia National Labs, Albuquerque, NM
Dr. Karoline Bernhard-Hofer , Infineon, Regensburg, Germany

See more of: Package and Physical Analysis Challenges
See more of: Tutorial