Mr. Michael Kögel

Fraunhofer Institute for Microstructure of Materials and Systems IMWS
Center for Applied Microstructure Diagnostics (CAM)
Halle Germany 06120

Papers:

Advanced 3D localization in Lock-In Thermography based on the analysis of the TRTR (Time-Resolved Thermal Response) received upon arbitrary waveform stimulation
GHz-Scanning Acoustic Microscopy combined with ToF-SIMS/AFM for wafer-level failure analysis of bonding interfaces.
Machine learning assisted signal analysis in Acoustic Microscopy for non-destructive defect identification