Board and System Level FA

Wednesday, November 13, 2019: 4:30 PM-5:20 PM
F 150/151 (Oregon Convention Center)
Mr. Jason Wheeler, Raytheon and Ms. Becky Holdford, Consultant
4:30 PM
Solder bump joint failure investigation: From sample preparation to advanced structural characterization and strain measurement
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
4:55 PM
The Development of an EVB Socket Solution for Automotive Mixed-Signal ICs
Mr. Eric Cattey, NXP Semiconductors
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