Board and System Level FA

Wednesday, November 13, 2019: 4:30 PM-5:20 PM
F 150/151 (Oregon Convention Center)
Mr. Jason Wheeler, Raytheon and Ms. Becky Holdford, Consultant
4:30 PM
Solder bump joint failure investigation: From sample preparation to advanced structural characterization and strain measurement
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
See more of: Technical Program