EDFAS Virtual Workshop
December 07 - 09, 2020
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Dr. Tom X. Tong
TMG Labs Manager
Intel Corp.
TMG Labs
Hillsboro, OR
USA 97124
Papers:
High Spatial and Energy Resolution Fault Isolation by Electron Beam Probing for Advanced Technology Nodes
Innovative Base Die Debug Technique with TSV Wirebond for 3D Stack-Die Devices