(V) Locate faulty components by IR based direct current injection method with Analog Signature Analysis
(V) Locate faulty components by IR based direct current injection method with Analog Signature Analysis
Thursday, November 4, 2021: 9:15 AM
104 ABC (Phoenix Convention Center)
Summary:
This article describes a method to integrate Analog Signature Analysis(ASA) into IR based Direct Current Inject method(IRDCI) for Printed Circuit Board Assembly failure analysis, which extends IRDCI application from diagnostic shorted power rails to any of measurement locations that shown signature differences, also it extends application on components failure modes from electrical short to breakdown or partially breakdown that can be identified by signatures comparison, and still keep high efficiency to eliminate the needs to guess and remove suspected faulty component one by one from board to validate.
This article describes a method to integrate Analog Signature Analysis(ASA) into IR based Direct Current Inject method(IRDCI) for Printed Circuit Board Assembly failure analysis, which extends IRDCI application from diagnostic shorted power rails to any of measurement locations that shown signature differences, also it extends application on components failure modes from electrical short to breakdown or partially breakdown that can be identified by signatures comparison, and still keep high efficiency to eliminate the needs to guess and remove suspected faulty component one by one from board to validate.