Panel Discussion: Overcoming the Challenges in System-in-Package Failure Analysis
Panel Discussion: Overcoming the Challenges in System-in-Package Failure Analysis
Wednesday, November 3, 2021: 10:35 AM-12:05 PM
West Hall 1-2 (Phoenix Convention Center)
Discussion points will include SiP fault isolation and failure analysis gaps and challenges, SiP in Advanced Driver-Assistance Systems (ADAS), Electrostatic Discharge (ESD) in SiP, and Wafer Level Chip Scale Package (WLCSP) for SiP devices. Distinguished field experts are invited to be on the panel to share their viewpoints and solutions based on their broad work experiences and diverse backgrounds, hopefully inspiring an engaged conversation among the panelists and the audience.
See more of: Technical Program