Fault Isolation and Physical Failure Analysis of IC-embedded OLED Display Device’s Failure

Summary:

In the failure analysis (FA) of display device, fault isolation and physical failure analysis (PFA) were studied to identify the root cause of display failure. It is challenging to conduct the FA of display device, as it consists of display panel, circuit board and components like semiconductor chips and this integration makes failure complicated and hard to analyze and understand. In case of display failure studied in this paper, the first work of fault isolation was not clear to identify the defective location and its PFA didn’t find out any defects. To precisely identify the defective location before destructive analysis, the fault isolation technique of OBIRCH was applied to display device and following PFA successfully identified the crack defect causing display failure. This result gave feedback to fab and in-fab parameter was adjusted to contain the defectivities of display device.