Studies and Applications of A New Delineation Method of Silicon Defects in Wafer Fabrication

Summary:

In this paper, we will propose a new delineation method of Silicon defects in wafer fabrication, especially provide a chemical recipe, which is mixed acids so that one could quickly and thoroughly remove polysilicon (Poly-Si), which could ensure the complete nudity of the silicon substrate, thereby avoiding manual labor caused by unclean peeling of the upper layer material of the wafer substrate. It could greatly improve accurate and repeatable of the results.