Exhibitor Dessert Reception, Poster Session and Video Contest

CASE STUDIES: FA PROCESSES - Complementary fault isolation procedures combining Laser Voltage Probing/Imaging and Lock-In Thermography: Case studies
Mr. Sukho Lee, NXP Semiconductors; Dr. Marc van Veenhuizen, NXP Semiconductors; Mr. Nivesh Rai, NXP Semiconductors

AI APPLICATION FOR FA: AI application in Yield and Failure Analysis to reduce overall Time-to-Defect and failure root-cause isolation
Mr. Sailesh C. Suthar, Intel Corporation; Mr. Lay Lay Goh, Intel Corporation

CASE STUDIES: FA PROCESSES - Applications of PVC and Progressive FIB Milling in Identifying Top-down Invisible Defect on Advanced Nodes SRAM Devices
Mrs. Wiwy Wudjud, Samsung Austin Semiconductor, LLC; Mr. Chan Dang, Samsung Austin Semiconductor, LLC; Mr. Kah Chin Cheong, Samsung Austin Semiconductor, LLC; Mr. Gregory B. Collins, Samsung Austin Semiconductor, LLC; Mr. Christopher Penley, Samsung Austin Semiconductor, LLC

HARDWARE ATTACKS, SECURITY AND REVERSE ENGINEERING - FTC: A Universal Low-Overhead Fault Injection Attack Detection Solution
Mr. Md Rafid Muttaki, University of Florida; Mr. Brian Barker, University of Florida; Dr. Farimah Farahmandi, Florida Institute for Cybersecurity, University of Florida; Dr. Mark M. Tehranipoor, Florida Institute for Cybersecurity, University of Florida; Mr. Henian Li, Florida Institute for Cybersecurity, University of Florida

MICROSCOPY AND MATERIAL ANALYSIS - AKONIS: SIMS Excellence Brought To The Fab
Dr. Anne-Sophie Robbes, CAMECA; Mr. Dan Jacobson, CAMECA Instruments Inc

CASE STUDIES: DEVICE ANALYSIS - The Impact of Ambient Humidity on the Surface Conductance of SiNx Films for Application in Capacitive MEMS Switches
Mr. Dimitris Birmpiliotis, National and Kapodistrian University of Athens (NKUA); Prof. George Papaioannou, University of Athens

CASE STUDIES: DEVICE ANALYSIS - Analog quiescent current as efficient method for accurate fault isolation in complex functional failures
Mr. Angelo Antonio Merassi, STMicroelectronics; Mr. Davide Passarella, STMicroelectronics; Mr. Emanuele Catanzaro, STMicroelectronics; Mr. Andrea Boglio, STMicroelectronics

DIE LEVEL FAULT ISOLATION: Logic State PEM Analysis for ATPG SCAN Logic Failure
Mr. Soon Woei Chong, Qualcomm Global Trading Pte Ltd.; Mr. Kan Sun, QUALCOMM; Wilson Cheng Hoe Lee, Qualcomm Global Trading Pte Ltd.; Mr. Hao Hu, QUALCOMM; Ms. Lesly Endrinal, QTI Qualcomm; Mr. Rahul Babu Radhamony, QUALCOMM

DIE LEVEL FAULT ISOLATION: A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-in Thermography
Mr. Ray Bienek, Cirrus Logic

NANOPROBING, ELECTRICAL CHARACTERIZATION: Electrostatic Discharge (ESD) Damage of Nanoprobes and How to Prevent It
Mr. Nels Anderson, Tiptek, LLC; Dr. Scott Lockledge, Ph.D., Tiptek, LLC

PACKAGING AND ASSEMBLY LEVEL FA: FA Methodology Comparison to Define Potential Root Cause on Lifted Copper Ball Bond
Ms. Pei Hoon Ong, Infineon Technologies (Malaysia) Sdn Bhd; Mr. Sze Yee Tan, Infineon Technologies Malaysis Sdn. Bhd; Ms. Chea Wee Lo, Infineon Technologies (Malaysia) Sdn Bhd

PACKAGING AND ASSEMBLY LEVEL FA: Chlorine and sulfur effects on gold-aluminum wire bond reliability
Dr. Lois Liao, Wintech-nano; Mr. Chris Cheong, Singapore Radiant OPTRONICS Pte. Ltd.

PRODUCT YIELD, TEST AND DIAGNOSTICS: Analysis of Retention Failure by Bulk Trap in DRAM
Mr. Dongguk Han, Samsung Electronics; Mr. Hoonchang yang, Samsung Electronics; Mr. Jinyeong Hwang, Samsung Electronics; Mrs. Jinseon Kim, Samsung Electronics; Mr. Kyoungrak Cho, Samsung Electronics; Dr. Incheol Nam, Samsung Electronics; Mr. Daesun Kim, Samsung Electronics Co.,Ltd; Mr. Beomseop Lee, Samsung Electronics; Dr. Sungsoo Yim, Samsung Electronics; Mr. Heeil Hong, Samsung Electronics; Mr. Jooyoung Lee, Samsung Electronics

SAMPLE PREP AND DEVICE DEPROCESSING: Decapsulating Small Outline Transistor (SOT) Packaged Devices using Acrylic Molding Technique
Mr. John Michael Saputil, Analog Devices

(V) SAMPLE PREP AND DEVICE DEPROCESSING: Novel and efficient approach in determining glue coverage for wafers mounted with glass carriers
Dr. Lingeswarran Muniandy, Infineon Technologies (Kulim) Sdn. Bhd; Mr. Soon Kiong Eric Wong, Infineon Technologies (Kulim) Sdn. Bhd; Mr. Pavic Ivan, Infineon Technologies Austria; Mr. Danial Ismail, Infineon Technologies (Kulim) Sdn. Bhd; Mrs. Theng Theng Tan, Infineon Technologies (Kulim) Sdn. Bhd

Studies and Applications of A New Delineation Method of Silicon Defects in Wafer Fabrication
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.; Mr. Li Xiaomin, WinTech Nano-Technology Services Pte. Ltd.; Mr. Chris Cheong, Singapore Radiant OPTRONICS Pte. Ltd.

SCANNING PROBE ANALYSIS: Inspection of charge effect on metal layer by using SCM
Mr. Lee Gyubaek, samsung electronics / Foundry division