48th International Symposium for Testing and Failure Analysis (Oct. 30 - Nov. 3, 2022)
October 30 - November 03, 2022
Menu
Home
Start
Browse
Browse by Day
At-A-Glance
Author Index
Chip Scale Packaging and Its Failure Analysis Challenges
Sunday, October 30, 2022: 1:30 PM
Ballroom A (Pasadena Convention Center)
Ms. Susan Li
,
Infineon Technologies, San Jose, CA
See more of:
Package and Physical Analysis Challenges II
See more of:
Tutorial