Package and Physical Analysis Challenges II

Sunday, October 30, 2022: 1:30 PM-2:30 PM

Ballroom A (Pasadena Convention Center)

Ms. Bernice Zee, Advanced Micro Devices (AMD) and Ms. Sarah Wozny, Intel

1:30 PM

Chip Scale Packaging and Its Failure Analysis Challenges
Ms. Susan Li, Infineon Technologies

See more of: Tutorial