Failure Analysis Techniques for Detection of Copper Migration in Die Attach Film

Thursday, November 3, 2022: 4:10 PM
Ballroom A (Pasadena Convention Center)
Ms. Dubhe Cyrine Bejo , Analog Devices, General Trias, Philippines
Mr. Greg Harold Posadas , Analog Devices, General Trias, Philippines
Mr. Romel De Guzman , Analog Devices, General Trias, Philippines
Ms. Margie Dalen Gobway , Analog Devices, General Trias, Philippines

See more of: Package Level Fault Isolation
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