Package Level Fault Isolation

Thursday, November 3, 2022: 3:45 PM-5:00 PM
Ballroom A (Pasadena Convention Center)
Mr. Stephen Fasolino, Raytheon and Dr. Daniel Braun, BMW AG
3:45 PM
INVITED TALK: TEM Imaging Dielectric Breakdown While It Happens
Dr. William A Hubbard, PhD, NanoElectronic Imaging, Inc.
4:10 PM
Failure Analysis Techniques for Detection of Copper Migration in Die Attach Film
Ms. Dubhe Cyrine Bejo, Analog Devices; Mr. Greg Harold Posadas, Analog Devices; Mr. Romel De Guzman, Analog Devices; Ms. Margie Dalen Gobway, Analog Devices
4:35 PM
Soft Defect Localization and Characterization for Advanced IC packaging using Novel EOTPR In-situ Dynamic Temperature Probing
Mr. Zhi Hao Ko, Xilinx; Dr. Thomas White, TeraView Limited; Dr. Jesse Alton, TeraView Limited; Mr. Martin Igarashi, TeraView Limited
See more of: Technical Program
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