(V) SAMPLE PREP AND DEVICE DEPROCESSING: Novel and efficient approach in determining glue coverage for wafers mounted with glass carriers

Wednesday, November 2, 2022
Exhibit Halls A & B (Pasadena Convention Center)
Dr. Lingeswarran Muniandy , Infineon Technologies (Kulim) Sdn. Bhd, Kulim, Malaysia, Infineon Technologies (Kulim) Sdn. Bhd, Kulim, Malaysia
Mr. Soon Kiong Eric Wong , Infineon Technologies (Kulim) Sdn. Bhd, Kulim, Malaysia
Mr. Pavic Ivan , Infineon Technologies Austria, Villach, Austria
Mr. Danial Ismail , Infineon Technologies (Kulim) Sdn. Bhd, Kulim, Malaysia
Mrs. Theng Theng Tan , Infineon Technologies (Kulim) Sdn. Bhd, Kulim, Malaysia

See more of: Exhibitor Dessert Reception, Poster Session and Video Contest
See more of: Technical Program