(V) Case Study on Sample Preparation Method to Eliminate the Artifact for Auger Analysis on Bond Pad
(V) Case Study on Sample Preparation Method to Eliminate the Artifact for Auger Analysis on Bond Pad
Tuesday, November 1, 2022: 4:10 PM
Ballroom B (Pasadena Convention Center)
Summary:
In today’s advanced technology world, electrical and electronic devices are playing a key role in modern electronic products that have energy proficiency highlights. These devices are required to be free from contamination especially on a bond pad to have good adhesion before proceeding to wire bond process at the back-end. Contamination on the bond pad leads to reliability issues such as pad corrosion, delamination and failure caused in the current pass through. Thus, Auger analysis is the most suitable technique to check bond pad contamination. Auger electron spectroscopy (AES) has the capability of providing compositional information with excellent spatial resolution. However, charging, noise or artifact is known to be a major obstacle to the characterization of insulating materials. This paper outlines the strategy that has been utilized to diminish the artifact, noise or charging impact for Auger investigation on a smaller bond pad surrounded by imide. Usually, a bond pad is surrounded by imide which is a type of passivation layer. This imide passivation layer causes a charging effect during auger analysis. This is because the insulator samples one of the difficulties for auger analysis to proceed. Apart from that, the charging effect leads to inaccurate results. In this paper, we rule out a safe method to be used during Auger analysis especially for small bond pads.
In today’s advanced technology world, electrical and electronic devices are playing a key role in modern electronic products that have energy proficiency highlights. These devices are required to be free from contamination especially on a bond pad to have good adhesion before proceeding to wire bond process at the back-end. Contamination on the bond pad leads to reliability issues such as pad corrosion, delamination and failure caused in the current pass through. Thus, Auger analysis is the most suitable technique to check bond pad contamination. Auger electron spectroscopy (AES) has the capability of providing compositional information with excellent spatial resolution. However, charging, noise or artifact is known to be a major obstacle to the characterization of insulating materials. This paper outlines the strategy that has been utilized to diminish the artifact, noise or charging impact for Auger investigation on a smaller bond pad surrounded by imide. Usually, a bond pad is surrounded by imide which is a type of passivation layer. This imide passivation layer causes a charging effect during auger analysis. This is because the insulator samples one of the difficulties for auger analysis to proceed. Apart from that, the charging effect leads to inaccurate results. In this paper, we rule out a safe method to be used during Auger analysis especially for small bond pads.