Sample Preparation and Device Deprocessing

Tuesday, November 1, 2022: 4:10 PM-5:00 PM
Ballroom B (Pasadena Convention Center)
* Package opening and device deprocessing
* Chemical etching methods
* Mechnanical polishing and laser preparation
Dr. Peng Li, Intel Corp. and Dr. Christopher H. Kang, Thermo Fisher Scientific
4:10 PM
(V) Case Study on Sample Preparation Method to Eliminate the Artifact for Auger Analysis on Bond Pad
Dr. Hemalatha Somu, Universiti Sains Malaysia
4:35 PM
An innovative technique for large-scale delayering of semiconductor devices with nanometric-scale surface flatness
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Mr. Junhai Lui, E.A. Fischione Instruments, Inc.; Mr. Michael F. Boccabella, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
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