DIE LEVEL FAULT ISOLATION: A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-in Thermography
DIE LEVEL FAULT ISOLATION: A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-in Thermography
Wednesday, November 2, 2022
Exhibit Halls A & B (Pasadena Convention Center)
Summary:
The application of a low-cost, USB-based module which can emulate various communication protocols (e.g. I2C, SPI) and also provide a synchronized timing pulse to externally trigger the ELITE thermography system, thus facilitating dynamic LIT investigations, is presented.
The application of a low-cost, USB-based module which can emulate various communication protocols (e.g. I2C, SPI) and also provide a synchronized timing pulse to externally trigger the ELITE thermography system, thus facilitating dynamic LIT investigations, is presented.
See more of: Exhibitor Dessert Reception, Poster Session and Video Contest
See more of: Technical Program
See more of: Technical Program