ENVIRONMENTAL X-RAY COMPUTED TOMOGRAPHY (E-CT): 3D CT AT ELEVATED TO CYROGENIC TEMPERATURES
ENVIRONMENTAL X-RAY COMPUTED TOMOGRAPHY (E-CT): 3D CT AT ELEVATED TO CYROGENIC TEMPERATURES
Monday, October 31, 2022: 11:35 AM
Ballroom D (Pasadena Convention Center)
Summary:
The infusion of new 2.5D and 3D solutions continues to drive advancements in the electronics packaging industry. However, these complex systems pose significant challenges in terms of reliability and qualification. In this paper, we introduce a new technique that may prove valuable for non-destructive, in-situ measurements of package and die warpage, and, subsequently, modelling verification.
The infusion of new 2.5D and 3D solutions continues to drive advancements in the electronics packaging industry. However, these complex systems pose significant challenges in terms of reliability and qualification. In this paper, we introduce a new technique that may prove valuable for non-destructive, in-situ measurements of package and die warpage, and, subsequently, modelling verification.