Soft Defect Localization and Characterization for Advanced IC packaging using Novel EOTPR In-situ Dynamic Temperature Probing

Thursday, November 3, 2022: 4:35 PM
Ballroom A (Pasadena Convention Center)
Mr. Zhi Hao Ko , Xilinx, Singapore, Singapore
Dr. Thomas White , TeraView Limited, Cambridge, United Kingdom
Dr. Jesse Alton , TeraView Limited, Cambridge, United Kingdom
Mr. Martin Igarashi , TeraView Limited, Cambridge, United Kingdom

See more of: Package Level Fault Isolation
See more of: Technical Program