A Correlative Microscopic Workflow For Nanoscale Failure Analysis and Characterization of Advanced Electronics Packages

Wednesday, November 2, 2022: 10:00 AM
Ballroom B (Pasadena Convention Center)
Dr. Thomas Rodgers , Carl Zeiss Microscopy, Dublin, CA
Mr. Allen Gu , Carl Zeiss Microscopy, Dublin, CA
Mr. Gregory Johnson , Carl Zeiss Microscopy, Dublin, CA
Masako Terada , Carl Zeiss Microscopy, Dublin, CA
Dr. Vignesh Viswanathan , Carl Zeiss Microscopy, Dublin, CA
Michael W. Phaneuf , Fibics Incorporated, Ottawa, ON, Canada
Joachim de Fourestier , Fibics Incorporated, Ottawa, ON, Canada
Ethan Ruttan , Fibics Incorporated, Ottawa, ON, Canada
Stewart McCracken , MCS Ltd, Edingburgh, United Kingdom
Suzanne Costello , MCS Ltd, Edingburgh, United Kingdom
Aiden M Robinson , MCS Ltd, Edingburgh, United Kingdom
Andrew Gibson , MCS Ltd, Edingburgh, United Kingdom
Alan Balfour , MCS Ltd, Edingburgh, United Kingdom

Summary:

A novel workflow is presented where a site-specific wire-bond cross section in a small system-in-package device is prepared, making use of only 3D X-ray microscopy (XRM) data.
See more of: Packaging and Assembly Level FA
See more of: Technical Program