Packaging and Assembly Level FA

Wednesday, November 2, 2022: 9:35 AM-11:40 AM
Ballroom B (Pasadena Convention Center)
Mr. Sherwin Tang, TSMC and Mrs. Sarah Wozny, Applied Materials
9:35 AM
Systematic failure analysis procedure for major assembly defects in clip bond surface mount devices
Mr. Ngoc Cuong Tran, ON Semiconductor Vietnam; Mr. Rommel Estores, onsemi
10:00 AM
A Correlative Microscopic Workflow For Nanoscale Failure Analysis and Characterization of Advanced Electronics Packages
Dr. Thomas Rodgers, Carl Zeiss Microscopy; Mr. Allen Gu, Carl Zeiss Microscopy; Mr. Gregory Johnson, Carl Zeiss Microscopy; Masako Terada, Carl Zeiss Microscopy; Dr. Vignesh Viswanathan, Carl Zeiss Microscopy; Michael W. Phaneuf, Fibics Incorporated; Joachim de Fourestier, Fibics Incorporated; Ethan Ruttan, Fibics Incorporated; Stewart McCracken, MCS Ltd; Suzanne Costello, MCS Ltd; Aiden M Robinson, MCS Ltd; Andrew Gibson, MCS Ltd; Alan Balfour, MCS Ltd
10:25 AM
Black Mushroom Formation on Aluminum Bond Pad
Dr. Yong Guo, Samsung Austin Semiconductor, LLC
10:50 AM
A Methodical Failure Analysis Approach using Thermomechanical Analysis in Reducing Recurring Failures on iButton Modules
Mr. John Albert P. AUSTRAL, Maxim Philippines Operating Corporation (now part of Analog Devices Inc.)
11:15 AM
Corrosion mechanisms of copper and gold ball bonds
Dr. Wentao Qin, onsemi
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