Systematic failure analysis procedure for major assembly defects in clip bond surface mount devices

Wednesday, November 2, 2022: 9:35 AM
Ballroom B (Pasadena Convention Center)
Mr. Ngoc Cuong Tran , ON Semiconductor Vietnam, Dong Nai, AZ, Viet Nam
Mr. Rommel Estores , onsemi, Oudenaarde, Belgium

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