INNOVATION IN COPPER BOND WIRE PACKAGE IMMERSION DECAPSULATION TECHNIQUE FOR STRESSED SOIC PRODUCTS

Wednesday, November 15, 2023: 8:20 AM
103 A-B (Phoenix Convention Center)
Mr. Brian P. Yabut , onsemi, Carmona, Cavite, Philippines
Ms. Rona Victoria C. Balabbo , onsemi, Carmona, Cavite, Philippines
Mr. Mac Hariss H. Masiris , onsemi, Carmona, Cavite, Philippines
Mr. Eugene C. Beboso , onsemi, Carmona, Cavite, Philippines

See more of: Sample Preparation and Device Deprocessing
See more of: Technical Program