Technical Program

Saturday, November 11, 2023

9:00 AM-1:00 PM

1:00 PM-5:00 PM

5:00 PM-7:00 PM

Sunday, November 12, 2023

7:00 AM-8:00 AM

7:00 AM-5:00 PM

10:00 AM-10:20 AM

12:20 PM-1:30 PM

3:30 PM-3:50 PM

Monday, November 13, 2023

7:00 AM-8:00 AM

7:00 AM-5:00 PM

7:45 AM-10:00 AM

10:00 AM-10:20 AM

10:20 AM-11:00 AM


Emerging FA Techniques and Concepts
Session Chair: Dr. Baohua Niu and Mr. Kah Chin Cheong

11:10 AM-11:50 AM


FIB Circuit Analysis and Edit
Session Chair: Mr. Antonio Tollis and Mr. Steven Herschbein

Power Devices (Si, SiC, GaN) I
Session Chair: Mr. Helmut Angerer and Dr. Marc Fouchier

11:50 AM-12:50 PM

12:50 PM-1:20 PM

12:50 PM-2:20 PM

1:20 PM-2:20 PM


Power Devices (Si, SiC, GaN) II
Session Chair: Mr. Helmut Angerer and Dr. Marc Fouchier

2:20 PM-3:00 PM

3:00 PM-4:00 PM


FIB Sample Preparation
Session Chair: Dr. Cathy Vartuli and Ms. Valerie Brogden

5:00 PM-6:30 PM

7:00 PM-10:00 PM

Tuesday, November 14, 2023

7:00 AM-8:00 AM

7:30 AM-6:30 PM

8:30 AM-9:30 AM

9:30 AM-10:10 AM

9:30 AM-6:00 PM

10:10 AM-11:30 AM


AI Applications for Failure Analysis
Session Chair: Dr. Yougui Liao and Dr. Sebastian Brand

10:10 AM-11:50 AM


Case Studies and Device Analysis
Session Chair: Mr. Greg Johnson and Dr. Yuyan Wang

11:50 AM-12:50 PM

12:50 PM-2:10 PM


Case Studies: FA Process and Workflows I
Session Chair: Dr. Wentao Qin and Dr. Juntao Li

1:50 PM-2:50 PM

2:10 PM-2:50 PM


Packaging and Assembly
Session Chair: Mrs. Sarah Wozny and Mr. Robert Constantin

2:50 PM-3:20 PM

3:20 PM-3:40 PM


System in Package and 3D Devices
Session Chair: Mr. Joseph Caroselli and Mr. Pradip Sairam Pichumani

3:20 PM-4:40 PM


Case Studies: FA Process and Workflows II
Session Chair: Dr. Wentao Qin and Dr. Juntao Li

3:40 PM-4:40 PM

4:30 PM-6:00 PM

Wednesday, November 15, 2023

7:00 AM-8:00 AM

7:30 AM-5:30 PM

8:00 AM-9:00 AM


Sample Preparation and Device Deprocessing
Session Chair: Dr. Christopher H. Kang and Ms. Sylvia Lewis

9:00 AM-9:30 AM

9:00 AM-4:00 PM

9:40 AM-10:20 AM


Scanning Probe Analysis
Session Chair: Mr. Phil Kaszuba and Dr. Daminda Dahanayaka

10:20 AM-11:00 AM


Boards and Systems
Session Chair: Ms. Seraina Murphy and Mr. Stephen Fasolino

10:20 AM-12:00 PM


Die Level Fault Isolation
Session Chair: Mr. Dan Bodoh and Ms. Lesly Endrinal

11:00 AM-12:00 PM

12:00 PM-1:30 PM

1:30 PM-3:00 PM

3:00 PM-3:15 PM

3:00 PM-4:00 PM

Thursday, November 16, 2023

7:00 AM-8:00 AM

7:30 AM-1:00 PM

8:00 AM-9:20 AM


Package Level Fault Isolation
Session Chair: Mr. Joseph Caroselli

8:00 AM-10:00 AM


Microscopy Analysis and Materials Characterization
Session Chair: Ms. Rose Ring and Dr. Cecile S. Bonifacio

9:20 AM-10:00 AM


Product Yield, Test, and Diagnostics
Session Chair: Mr. Jayant D'Souza and Dr. Shraddha Bodhe

10:00 AM-10:20 AM

10:20 AM-11:20 AM

11:20 AM-11:30 AM

11:30 AM-12:30 PM

11:50 AM-12:30 PM


Detecting and Preventing Counterfeit Microelectronics
Session Chair: Mr. Maxwell Hamilton, Ms. Pamela C. Calica and Mr. Kevin Awai

12:30 PM-1:30 PM

1:30 PM-2:10 PM


Nanoprobing and Electrical Characterization I
Session Chair: Mr. David Albert and Mr. John Sanders

1:30 PM-2:30 PM


Hardware Attacks, Security, and Reverse Engineering I
Session Chair: Mr. Kevin Awai and Dr. Mike Bruce

2:30 PM-2:50 PM

2:50 PM-3:30 PM


Nanoprobing and Electrical Characterization II
Session Chair: Mr. David Albert and Mr. John Sanders

2:50 PM-3:50 PM


Hardware Attacks, Security, and Reverse Engineering II
Session Chair: Mr. Kevin Awai and Dr. Mike Bruce