Lock-in thermography for the localization of security hard blocks on SoC devices

Thursday, November 16, 2023: 2:50 PM
104 A-B (Phoenix Convention Center)
Mr. Michael Koegel , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Saxony-Anhalt, Germany
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Saxony-Anhalt, Germany
Mr. Frank Altmann , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Saxony-Anhalt, Germany
Mr. Bodo Selmke , Fraunhofer AISEC, Garching, Bavaria, Germany
Mr. Kilian Zinnecker , Fraunhofer AISEC, Garching, Bavaria, Germany
Mr. Robert Hesselbarth , Fraunhofer AISEC, Garching, Bavaria, Germany
Dr. Nisha Jacob Kabakci , Fraunhofer AISEC, Garching, Bavaria, Germany

Summary:

The paper highlights the potential of LIT as a valuable tool for reverse engineering analysis and physical assurance. The authors describe the underlying principles of the technique and present the methodology used to modify the classic lock-in setup for the thermal localization of hard blocks on SoC. The results show that LIT is an effective technique for identifying and localizing security hard blocks on integrated circuits.