Mr. Brian P. Yabut

Failure Analysis Technician
onsemi
Global Failure Analysis
Carmona, Cavite
Philippines 4116

Papers:

INNOVATION IN COPPER BOND WIRE PACKAGE IMMERSION DECAPSULATION TECHNIQUE FOR STRESSED SOIC PRODUCTS
Discoloration: A Case of Mistaken Identity Callout For Reliability Stressed Palladium Coated Copper (PCC) Wires After Mold Compound Removal