Package and Physical Analysis Challenges Tutorial II

Sunday, November 12, 2023: 10:20 AM-12:20 PM

103 A-B (Phoenix Convention Center)

Mrs. Sarah Wozny, Applied Materials

10:20 AM

Fan Out for Advanced Packaging Applications
Ms. Jan Vardaman, Tech Search Inc.; Mr. John Hunt, TechSearch International, Inc.

11:20 AM

Failure Analysis Challenges for Chip Scale Packages
Ms. Susan Li, Infineon Technologies

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