Video Contest

12:00 AM
3D Reconstruction of High Bandwidth Memory Package by Automated Plasma-FIB Slice and View
Dr. Mark McClendon, Thermo Fisher Scientific; Ms. Melissa Mullen, Thermo Fisher Scientific
12:20 AM
What happens to a solder ball during the reflow process?
Dr. Noriyuki Inoue, JEOL USA, Inc.; Mr. Takeshi Otsuka, JEOL Ltd.; Ms. Natsuko Asano, JEOL Ltd.; Dr. Shunsuke Asahina, JEOL Ltd.
12:40 AM
The fog is lifting
Mrs. Susanne Hübner, Fraunhofer Institute for Mechanics of Materials IWM
1:00 AM
Artifact-free data collection with multi-probe head AFM
Mr. Srijan Chakrabarti, Arizona State University
1:20 AM
Electrical Probing on 5 nm Technology
Dr. Andrew Jonathan Smith, Kleindiek Nanotechnik; Dr. Lorenz Lechner, Kleindiek Inc.
1:40 AM
Integrated Workflows at FA
Mr. Florian Felux, Infineon Technologies AG; Dr. Nicole Killat, Infineon Technologies AG
2:00 AM
Phase Segmentation in a Superjunction MOSFET using FIB-SEM tomography and 3D EDX
Mr. Flavio Cognigni, Sapienza University of Rome; Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Dr. Domenico Mello, STMicroelectronics
2:20 AM
AFM-in-SEM on IGBT lamella
Mr. Greg Johnson, ZEISS Microscopy; Dr. Frank Hitzel, DoubleFox GmbH; N/A Andi Mährlein, ANDICAM GmbH
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