Innovative Fault Localization Techniques for ATPG failures in Wire-Bonded BGA packages
Innovative Fault Localization Techniques for ATPG failures in Wire-Bonded BGA packages
Tuesday, October 29, 2024: 2:00 PM
204 (Hilton San Diego Bayfront)
Summary:
This work explores the use of digital power supply as a means of activating defect inside logic areas, as an alternative to complex electrical setups, overcoming package related limitations.
This work explores the use of digital power supply as a means of activating defect inside logic areas, as an alternative to complex electrical setups, overcoming package related limitations.