Increasing TEM Prep Throughput with an Extendable Manipulator Tip

Wednesday, October 30, 2024: 11:40 AM
204 (Hilton San Diego Bayfront)
Ms. Valerie Brogden , University of Oregon, Eugene, OR
Mr. Jefferson Garman , CAMCOR, University of Orego, Eugene, OR
Mr. Kurt Langworthy , CAMCOR - University of Oregon, Eugene, OR
Mr. Steve Wiemholt , CAMCOR, University of Oregon, Eugene, OR

Summary:

In this study, we introduce a novel enhancement for nanomanipulator probes within Focused Ion Beam Scanning Electron Microscopes (FIB SEM), designed to significantly improve operational efficiency and reduce downtime during Transmission Electron Microscopy (TEM) sample preparation, a critical process for industries reliant on TEM analysis. Our innovation consists of an attachment that enables operators to extend the nanomanipulator needle further into the vacuum chamber. This mechanism is poised to elevate throughput and diminish the instrument's downtime, which is pivotal for TEM prep—a process integral to semiconductor manufacturers like Samsung and Intel, where the demand for TEM samples is high due to the necessity for process characterization and failure analysis of integrated circuits. Traditionally, the manipulator needle shortens with each sample preparation, ultimately reaching a mechanical limit that necessitates system venting to install a new needle—a process resulting in approximately 30 minutes of downtime. Furthermore, the needle can be bent and curled by accidental collisions within the system. This poses a frequent challenge, particularly for new users or during deliberate sample grounding, exacerbating system downtime. The lack of a standardized needle length and the absence of a hard-stop in the needle holder complicate the needle replacement process, making it prone to alignment errors. Even expert users often have to vent and pump the SEM FIB multiple times before the needle is at the proper length, potentially causing hours of additional downtime. Our proposed mechanism addresses these challenges by allowing for the extension of the needle further into the vacuum chamber without venting the tool. This innovation not only increases the usable lifetime of each needle, thus conserving resources, but also streamlines the needle replacement process, mitigating the need for multiple vent pump cycles. Additionally, it simplifies the alignment process by eliminating the reliance on a magnifying glass, which is error prone. Users can adjust the needle to the correct length directly under SEM observation. This advancement holds a significant value proposition for FIB labs across various industries, particularly for the semiconductor industry, where the efficiency of TEM sample preparation directly impacts productivity. By offering a solution that speeds up throughput and reduces tool downtime, this development has the potential to bring about substantial economic benefits and operational improvements.
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