Inexpensive and Efficient Backside Decapsulation Technique for Challenging Down Bond Devices

Thursday, October 31, 2024

Indigo Ballroom (Hilton San Diego Bayfront)

Mr. Chaoliang Cheng , Texas Instruments Semiconductor Technologies (Shanghai) Co., Ltd., SHANGHAI, Shanghai, China

Ms. Jing Zhou , Texas Instruments Semiconductor Technologies (Shanghai) Co., Ltd., SHANGHAI, Shanghai, China

Dr. Yuyan Wang , Texas Instruments, Dallas, TX

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