Thursday, October 31, 2024: 2:30 PM-3:45 PM
Indigo Ballroom (Hilton San Diego Bayfront)
Don't forget to cast your vote for the best poster and video during the poster session! Simply use the app's survey icon to vote!
Implementation of FIB Automation Methodologies for TEM Applications in Memory Devices.
Dr. Sang Hoon Lee, PhD, Micron Technology;
Mr. Joshua-Adams Miller, Micron Technology;
Mrs. Veronica Perez, Micron Technology;
Mr. Kenton Burns, Micron Technology;
Dr. Xue Rui, PhD, Micron Technology;
Dr. Ning Lu, PhD, Micron Technology;
Dr. Qiang Jin, PhD, Micron Technology;
Mr. Stárek Jaroslav, Thermo Fisher Scientific;
Mr. Viktor Švéda, Thermo Fisher Scientific;
Mr. Trevan Landin, Thermo Fisher Scientific;
Mr. Libor Strakoš, Thermo Fisher Scientific;
Mr. Lukáš Hübner, Thermo Fisher Scientific;
Mr. Sven Beunen, ASML;
Dr. Cheng-han Li, PhD, ASML;
Dr. Shixin Wang, PhD, Micron Technology;
Mr. Davin Fast, Thermo Fisher Scientific;
Dr. Lian Zhen, PhD, Thermo Fisher Scientific;
Mr. Gabriel Woodworth, Thermo Fisher Scientific;
Dr. Yun-Yu Wang, PhD, Micron Technology;
Ms. SookFun Chan, Micron Technology;
Mr. David Prentice, Thermo Fisher Scientific;
Mr. Robert Gifford, Micron Technology;
Mr. Tyler Lenzi, Micron Technology
IC Backside De-processing Physical Failure Analysis with Laser Ablation Technique
Mr. P. K. Tan, Globalfoundries Singapore Pte Ltd.;
Dr. S. L. Ting, Globalfoundries Singapore Pte Ltd.;
Ms. Angela Teo, Globalfoundries Singapore Ltd.;
Dr. N.Y. Xu, Globalfoundries Singapore Ltd.;
Mr. Yong Seng Tam, Globalfoundries Singapore Ltd.;
Ms. Jessica S.J. Oh, Globalfoundries Singapore Ltd.;
Mr. K.K. Kang, Globalfoundries Singapore Ltd.;
Mr. Andhika Firdhani roslan, Globalfoundries Singapore Ltd.;
Ms. Nivasini Thiruppathi, Globalfoundries Singapore Ltd.;
Dr. Gautama Wicaksono, Globalfoundries Singapore Pte Ltd.;
Ms. H. H. W. Thoungh, Globalfoundries Singapore Pte Ltd.;
Ms. T.T. Yu, Globalfoundries Singapore Pte Ltd.;
Dr. Alfred Quah, GLOBALFOUNDRIES Singapore;
Dr. Changqing Chen, Globalfoundries Singapore;
Mr. P.T. Ng, Globalfoundries Singapore Pte Ltd.
A Quantitative and Automated Quality Metric for Delayering Integrated Circuits
Mr. Noah Padro, Battelle Memorial Institute;
Dr. Timothy Balint, Battelle Memorial Institute;
Mr. Nick Harner, Battelle Memorial Institute;
Mr. Jon Scholl, Battelle Memorial Institute;
Mr. Yash Patel, Battelle Memorial Institute;
Dr. Adam Kimura, Battelle Memorial Institute;
Mr. Matt Sale, Air Force Research Lab
SYSFID: System-Aware Fault-Injection Attack Detection For System-in-Package Architectures
Mr. Amit Mazumder Shuvo, University of Florida;
Mr. Md Sami Ul Islam Sami, University of Florida;
Mr. Md Latifur Rahman, University of Florida;
Dr. Jingbo Zhou, University of Florida;
Dr. Kimia Zamiri Azar, University of Florida;
Prof. Farimah Farahmandi, Florida Institute for Cybersecurity, University of Florida;
Prof. Mark M. Tehranipoor, Florida Institute for Cybersecurity, University of Florida
Automating Submicron IR measurements for Failure Analysis
Mr. Jay Anderson, Photothermal Spectroscopy Corp.;
Dr. Michael K. Lo, PhD, Photothermal Spectroscopy Corp.;
Dr. Eoghan Dillon, Photothermal Spectroscopy Corp;
Dr. Mustafa Kansiz, PhD, Photothermal Spectroscopy Corporation;
Dr. Ting Yan, Photothermal Corp
Etching monitoring of advanced forksheet devices using AKONIS SIMS tool
Dr. Anne-Sophie Robbes, CAMECA;
Dr. Olivier Dulac, CAMECA;
Mr. Kilian Soulard, CAMECA;
Mrs. SeoYoun Choi, CAMECA;
Dr. Marie Adier, CAMECA;
Mr. Dan Jacobson, CAMECA Instruments Inc;
Dr. Alex Merkulov, imec;
Dr. Rita Tilmann, imec;
Dr. Paul van der Heide, imec;
Dr. Alexis Franquet, imec
Electrostatic Force Microscopy Technique for Understanding Failures in Polyimide Insulation Barriers
Dr. Srikanth Kolagatla, Analog Devices Inc.;
Prof. Sombel DIAHAM, Analog Devices Inc., LAPLACE, Université de Toulouse;
Mr. Paul Lambkin, Analog Devices Inc.;
Dr. Ricky Anthony, Analog Devices Inc.;
Ms. Megan McCarthy, Analog Devices Inc.;
Mrs. Subha Lakshmanan, Analog Devices Inc.;
Dr. Ramji Lakshmanan, Analog Devices Inc.;
Mr. Jer O’Sullivan, Analog Devices Inc.
The Advanced Failure Analysis methods based on Dynamic Hot Electron Analyzer and IDD3P Measurements for HKMG Sub-nm DRAM
Ms. Sunah Lee, Samsung Electronics;
Mr. Jihoon Son, Samsung Electronics;
Mr. Jihoon Park, Samsung Electronics;
Ms. Bohyeon Jeon, Samsung Electronics;
Mr. Seokmin Yun, Samsung Electronics;
Ms. Chae Soo Kim, Samsung Electronics;
Ms. Hakyeong Kwon, Samsung Electronics;
Ms. Jayoung Lee, Samsung Electronics;
Mr. Sangjun Kim, Samsung Electronics;
Mr. Ilwoo Jung, Samsung Electronics;
Mr. SeGuen Park, Samsung Electronics
