Failure investigation of copper-to-copper bonding in advanced 3D packaging: From sample preparation to structural characterization

Friday, November 1, 2024: 8:00 AM
204 (Hilton San Diego Bayfront)
Dr. Pawel Nowakowski , E.A. Fischione Instruments, Inc., Export, PA
Dr. Richard Li , E.A. Fischione Instruments, Inc., Export, PA, E.A. Fischione Instruments, Inc., Export, PA
Ms. Mary Ray , E.A. Fischione Instruments, Inc., Export, PA
Mr. Paul Fischione , E.A. Fischione Instruments, Inc., Export, PA

See more of: System in Package and 3D Devices
See more of: Technical Program