System in Package and 3D Devices

Friday, November 1, 2024: 8:00 AM-9:40 AM
204 (Hilton San Diego Bayfront)
Dr. Christian Schmidt, Nvidia and Mr. Neel leslie, Thermo Fisher Scientific
8:00 AM
Failure investigation of copper-to-copper bonding in advanced 3D packaging: From sample preparation to structural characterization
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Dr. Richard Li, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
8:20 AM
Concept-Proof of Lock-in OBIRCH Application for Three-Dimensional Analysis of Four-Dimensional NAND Flash Memory
Dr. Norimichi Chinone, Hamamatsu Corporation; Mr. Akihito Uchikado, Hamamatsu Photonics K.K.
8:40 AM
Innovations in Beam-Based Defect Localization Methods for Advanced 3D Interconnects
Dr. Kristof J.P. Jacobs, imec; Mr. Toru Matsumoto, Hamamatsu Photonics K.K.; Mr. Shimpei Tominaga, Hamamatsu Photonics K.K.; Dr. Eric Beyne, Imec; Mr. Hirotoshi Terada, Hamamatsu Photonics K.K.
9:00 AM
Application to a failure analysis of Visible Thermal Dynamic @ Imaging
Mr. Shimpei Tominaga, Hamamatsu Photonics K.K.; Dr. Norimichi Chinone, Hamamatsu Photonics K.K.; Mr. Yuhei Aoshima, Hamamatsu Photonics K.K.; Mr. Akihito Uchikado, Hamamatsu Photonics K.K.; Dr. Tomonori Nakamura, Hamamatsu Photonics K.K.; Mr. Toru Matsumoto, Hamamatsu Photonics K.K.; Mr. Yunki Jung, SAMSUNG ELECTRONICS Co.Ltd; Mr. Sung Ho Lee, Samsung Electronics co. Ltd; Mr. Sangmin Han, SAMSUNG ELECTRONICS Co.Ltd; Ms. Hyeongki Kim, Samsung Electronics; Mr. Masataka Ikesu, Hamamatsu Photonics K.K.
9:20 AM
X-ray nano-tomography enabling sub-micron resolution failure analysis for advanced packaging
Dr. Till Dreier, Excillum AB; Dr. Daniel Nilsson, Excillum AB; Dr. Jesper Wittborn, Ericsson; Dr. Julius Hållstedt, Excillum AB
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