Application of Thermal Emission Phase-Lock Image Statistics to locate defects in Z-depth for Advanced 2.5D Packaging

Thursday, October 31, 2024
Indigo Ballroom (Hilton San Diego Bayfront)
Mr. Daniel Nuez , AMD, San Jose, CA
Mr. Phoumra Tan , AMD, San Jose, CA
Mr. Brian Lai , Thermo Fisher Scientific, Fremont, CA

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See more of: Technical Program