Application to a failure analysis of Visible Thermal Dynamic @ Imaging

Friday, November 1, 2024: 9:00 AM
204 (Hilton San Diego Bayfront)
Mr. Shimpei Tominaga , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Dr. Norimichi Chinone , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Mr. Yuhei Aoshima , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Mr. Akihito Uchikado , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Dr. Tomonori Nakamura , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Mr. Toru Matsumoto , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan
Mr. Yunki Jung , SAMSUNG ELECTRONICS Co.Ltd, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South), SAMSUNG ELECTRONICS Co.Ltd, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South)
Mr. Sung Ho Lee , Samsung Electronics co. Ltd, Suwon, Korea, Republic of (South)
Mr. Sangmin Han , SAMSUNG ELECTRONICS Co.Ltd, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South)
Ms. Hyeongki Kim , Samsung Electronics, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South)
Mr. Masataka Ikesu , Hamamatsu Photonics K.K., Hamamatsu, Shizuoka, Japan

Summary:

We have improved the sensitivity of ThermoDynamic ® Imaging technology, which detects differences in reflectance due to heat.
See more of: System in Package and 3D Devices
See more of: Technical Program