RF-LIT use case studies

Wednesday, October 30, 2024: 10:20 AM
202 (Hilton San Diego Bayfront)
Dr. Marc van Veenhuizen , NXP Semiconductors, Nijmegen, Netherlands
Mr. Eric Meeuwsen , NXP Semiconductors, Nijmegen, Netherlands
Mr. Keying Lin , NXP Semiconductors, Nijmegen, Netherlands
Mr. Maarten Nab , NXP Semiconductors, Nijmegen, Netherlands
Mr. Mohammed Achour , NXP Semiconductors, Nijmegen, Netherlands
Mr. Pieter Gommers , NXP Semiconductors, Nijmegen, Netherlands
Mr. Varun Thukral , NXP Semiconductors, Nijmegen, Netherlands

Summary:

This paper discusses the application of the RF-LIT technique to a variety of use cases. The technique itself was introduced during last year’s ISTFA 2023 conference. The present work aims to showcase its suitability for the analysis of polyline cracks and packaging related fails such as via opens in RDL as well as cracks in solder joints. Further, a model is constructed explaining why RF-LIT can work and where the frequency dependence comes from.
See more of: Package Level Fault Isolation
See more of: Technical Program