Package Level Fault Isolation

Wednesday, October 30, 2024: 10:00 AM-11:20 AM
202 (Hilton San Diego Bayfront)
Ms. Sylvia Lewis, Sigray, Inc. and Ms. Susan Li, Infineon Technologies
10:00 AM
Advanced Package Fault Simulation: The Impact of Accelerated Trace Model Generation
Dr. Chuan Zhang, NVIDIA Corporation; Mr. Joseph Sanchez, NVIDIA Corporation; Mr. John Aguada, NVIDIA Corporation; Mr. Arpan Bhattacherjee, NVIDIA Corporation; Dr. Jane Y. Li, NVIDIA Corporation
10:20 AM
RF-LIT use case studies
Dr. Marc van Veenhuizen, NXP Semiconductors; Mr. Eric Meeuwsen, NXP Semiconductors; Mr. Keying Lin, NXP Semiconductors; Mr. Maarten Nab, NXP Semiconductors; Mr. Mohammed Achour, NXP Semiconductors; Mr. Pieter Gommers, NXP Semiconductors; Mr. Varun Thukral, NXP Semiconductors
10:40 AM
FA Challenges and Case Study Exploration of multi-die Fan-out Wafer Level Packages
Ms. Bernice Zee, Advanced Micro Devices (AMD); Ms. Wen Qiu, Advanced Micro Devices (AMD); Mrs. Syahirah MD Zulkifli, Advanced Micro Devices (AMD)
11:00 AM
A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages
Dr. Allen Gu, Zeiss Microscopy; Carl Zeiss Microscopy
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