Development of Novel Methods for Grinding and Polishing of 3DHI Devices
Development of Novel Methods for Grinding and Polishing of 3DHI Devices
Thursday, October 31, 2024
Indigo Ballroom (Hilton San Diego Bayfront)
Summary:
Three-Dimensional Heterogeneous Integration (3DHI) devices pose new challenges to sample preparation. We explore new approaches to sample preparation using improved processing and automation to address difficulties in grinding and polishing these dies.
Three-Dimensional Heterogeneous Integration (3DHI) devices pose new challenges to sample preparation. We explore new approaches to sample preparation using improved processing and automation to address difficulties in grinding and polishing these dies.