Dr. Heiko Stegmann

EMEA Applications Support Crossbeam
Carl Zeiss Microscopy GmbH
Oberkochen, Oberkochen
Italy 73447

Papers:

Basics and Current Aspects of Scanning Electron Microscopy
Integrating Multimodal Microscopy and Artificial Intelligence Solutions for Laser Dicing Process Induced Defect Identification
Few-shot AI segmentation of semiconductor device FIB-SEM tomography data
AI-driven Advancements in Image Processing, Analysis and 3D Modeling for Fault Isolation and Failure Analysis
Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-node SRAMs