AI Applications for Failure Analysis

Thursday, October 31, 2024: 8:00 AM-9:40 AM
202 (Hilton San Diego Bayfront)
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS and Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
8:00 AM
Optical Automated Interconnect Inspection of Printed Circuit Boards
Mr. Patrick Craig, University of Florida; Mr. Jonathan Pearson, University of Florida; Mr. Shajib Ghosh, University of Florida; Mr. Nitin Varshney, University of Florida; Dr. Sanjeev J. Koppal, FOCUS Lab; Dr. Navid Asadizanjani, Florida Institute for Cybersecurity, University of Florida
8:20 AM
Enhancing Semiconductor Nanoprobing Procedures with AI-Driven Tip Detection
Mr. David Kleindiek, Kleindiek Nanotechnik; Dr. Matthias Kemmler, Kleindiek Nanotechnik; Dr. Andreas Zell, University of Tübingen
8:40 AM
Few-shot AI segmentation of semiconductor device FIB-SEM tomography data
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Dr. Flavio Cognigni, Carl Zeiss SpA
9:00 AM
Automating Routing of Product Returns for Failure Analysis with Neuro-Symbolic AI
Mr. Felix Mitterer, Infineon; Mr. Christian Burmer, Infineon Tech. AG; Dr. Konstantin Schekotihin, Universität Klagenfurt
See more of: Technical Program
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