Sample Preparation User Group Discussion
Sample Preparation User Group Discussion
Thursday, October 31, 2024: 8:00 AM-9:00 AM
The Pointe (Hilton San Diego Bayfront)
Moderators:Jim Colvin, FA Instruments, Inc.
Cecile Bonifacio, Fischione Instruments
Rosine Germanicus, Université de Caen Normandie
Bryan Tracy, ibss Group
Nathan Bakken, Intel
Lihong Cao, ASE Technology Holding Co., Ltd.
As More-than-Moore (MTM) technologies push the boundaries of device complexity, the demand for high-quality samples has never been greater. An example for this is the backside power delivery to improve performance and power efficiency of devices. Successful failure analysis of semiconductor devices highly depends on high quality samples.
Join us for an interactive discussion exploring the latest advancements in sample preparation techniques for semiconductor failure analysis.
Key Topics:
- Conquering MTM Challenges: Discuss strategies for handling heterogeneous materials, thin layers, and contamination control
- Specific Sample Prep Techniques: Dive deep into techniques like mechanical polishing, ion milling, FIB, and thermal management.
- Leveraging AI for Sample Prep: Explore how AI can streamline tasks like selection, alignment, defect detection and device layer removal
- Case Studies: Learn from real-world examples of successful sample preparation for complex MTM devices.
Don't miss this opportunity to connect with experts and gain valuable insights. Given the diverse range of expertise in the room, it's likely that someone will have the answer you're looking for.
See more of: Technical Program